
HYPERSEAL®-25LM-S is a novel low modulus expansion joint sealant, especially formulated to contain both PU and silylated-PU technology, thus giving rise to a sealant which includes the best of both technologies. It has been modified in order to give enhanced thixotropic properties. It cures by reaction with atmospheric humidity to produce a joint sealant with a 50% joint movement accommodation factor and excellent adhesion on substrates traditionally problematic for PU sealants, e.g. glass, aluminum, steel, polycarbonate, etc. Additionally, the gunnable sealant has been modified in order to have extrusion profile identical to hybrid PU or MS technology. The extrusion rate and tooling of the sealant remain the same throughout a very wide range of temperature and humidity conditions.
TDS Hyperseal-25lms_-_v2.5., PDF, 146.66kBDOWNLOAD NOW